Filled and thixotropic
Use these grades when the adhesive needs body, bead control, lower shrinkage, or component protection.
These products include filled and thixotropic cationic epoxies for glob top, dam-and-fill, vertical joints, and high-temperature filled bonds. They are a better starting point than low-viscosity grades when flow control matters.
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Thixotropic UV epoxy with magenta-to-clear cure indicator
UV-8701E is a thixotropic epoxy with bead control and a magenta-to-clear cure indicator for visual confirmation.
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Filled, low-shrinkage UV epoxy for high-temperature service
UV-3700F is a filled epoxy for better gap control and higher-temperature service than low-viscosity wetting grades.
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Filled glob-top UV epoxy for chip encapsulation
UV-5403S is a filled encapsulant for glob-top and chip protection work with fast LED/UVA cure and low-shrinkage behavior.
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Compare adjacent cure paths, flow profiles, and product data before moving into a specific grade recommendation.